12 I ICT TODAY
FIGURE 6: High-density connectivity platform.
economic benefit. The different module options are key
in supporting a forward path. Along with the standard
splice and MPO-to-LC fanout cassettes, there is need for
conversion and patching solutions that enable easy migra-
tion through new technologies (i.e., 40 GbE to 100 GbE)
while enabling use of the existing cabling infrastructure
(Figures 6 and 7).
It is crucial to understand what the roadmap is
of any given fiber management provider. The benefit
of a modular solution is that new modules can be devel-
oped to support new and emerging technologies or archi-
tectures. One example is the nano connector from various
companies targeting primarily the 400 GbE and beyond
architectures. These reduced-size connectors provide
a greater level of density than traditional LCs. Designed
around a ceramic ferrule technology, they do not experi-
ence the same connection repeatability challenges often
observed with MPOs.
It is important that designers and installers under-
stand that some of the new nano connector solutions
utilizing adapters, certain patch panels, fanouts and
other non-direct LC and MPO connectivity may not
comply with certain industry standards. For example,
FIGURE 7: Cassette options.
Typical Cassette Options
Splice
Conversion Patch
Fanout
