Issue link: https://www.e-digitaleditions.com/i/1219491
48 I ICT TODAY at >55 dB per connector. These same quality performance benchmarks are also being used for the upcoming 192-f connector undergoing IEC compliance testing. • Extreme capacity with fiber strand counts of up to144-fibers • Supports 32-f to 144-f strands; 192-f in development • Available in 32-f, 48-f, 64-f, 96-f, 144-f strand configurations ready for production • Small form factor, high density • Highest performance and lowest dB loss (96-f per IEC 61300-3-34, IEC 61753-1) • Quick polarity flips and gender changes • Self-cleaning to eliminate dust and debris • Self-protecting shield shroud • Grouped for QSFP; for example, the 32-f version, having 4 discrete ferrules on it with each having 8 strands, would have 4 QSFP connectors built into it • Easy reach and push-twist connect operation • The hyper-capacity connector and its various configurations are currently being manufactured by a well-known ICT manufacturer most reputable for its stringent quality assurance and quality control processes One of the major achievements in the design of the hyper-capacity connector is that it fits so many needed FIGURE 18: Shown is the hyper-capacity connector. The only closely comparable connector for IEC testing is a high quality high-capacity MPO 24-f connector with an average insertion loss performance of <0.50 dB. The 96-f version was stringently third-party and IEC tested against the MPO 24-f and consistently produced the <0.35 dB insertion loss. features with high-capacity 144-fibers (and soon 192- fibers) while producing consistently low <0.35 dB inser- tion loss and >55 dB return loss for ITU-T G.657.A1 and G652.D compliant SMF (Figure 18). The hyper-capacity connector product line also includes patented technologies that help adapt the con- nector to existing device and infrastructure technologies including LC, MPO/MTP, and QSFP. Its patch panel can convert the hyper-capacity, self-cleaning and protecting universal multi-fiber connector to any current or future connector technology, while providing the freedom and flexibility to meet specific physical infrastructure requirements. For example, the patch panels can con- vert the hyper-capacity connector (any number of strands) to LC and MPO/MT at the infrastructure port and to QSFP connector(s) at the transceiver, as well as many other applications (Figure 19). FIGURE 19: Shown is the patch panel that would convert, for example, a hyper-capacity 96-f connector (rear) to 48 LC connectors (front). This configuration was tested per IEC 61300-3-34 and IEC 61753-1 and resulted in low insertion losses (≤0.35 dB for the 96-f connector and ≤0.25 dB for the LCs) for >97% of random mating samples for SMF. The return loss for the hyper-capacity and LCs were >55 dB.